IMS3TW 2011 - Call for Papers

Submission Deadline Extended to February 21, 2011!

CALL FOR PAPERS

Scope -- Submissions -- KeyDates -- Additional Information -- Committees

Scope

Seventeen years ago, the IEEE Mixed-Signal Test Workshop (IMSTW) was inaugurated as a forum focused on test and design issues related to electronic systems with digital and analog components. In view of accelerated developments in heterogeneous system design and production, IMSTW was expanded in 2008 to include new topics thataddress test, design for test, reliability and manufacturability of today’s sensors and sensor-based systems, as well as emerging devices and systems. Renamed to include ensors and systems, IMS3TW aims to bring together a community of researchers working on the next-generation mixed-signal devices, circuits and systems. This year, IMS3TW’11 will continue to address the traditional technology spectrum of IMSTW, in particular all aspects of analog, mixed signal, and RF testing, but with increased attention to all aspects of current design complexity (e.g., parametric variability, power consumption, temperature effects). To guaranteeing design robustness for the new generation of nanoelectronic devices, we need to exploit self-monitoring functionality (such as self-test/-calibration, allowing the circuit or system to adapt to varying circuit parameters or functional demands. The sensors focus of the workshop will highlight all aspects of built-in sensors for device adaptation, MEMS, and biomedical applications such as lab-on-chip and implantable devices.

Primary Topics of Interest include:

Test & Design for (on/off-line) Test
Reliability & Design for Reliability
Fault/Error Modelling & Simulation
Fault Tolerance

Verification amp; Design for Verification
Post-Silicon Validation
Diagnosis & Design for Debug/Diagnosis

Pertaining to the following systems or underlying technologies:

Analog/Mixed-Signal Circuits
Biomedical Circuits & Systems
RF & Wirelessly Controlled Devices
Optoelectronics & Photonics
Drug Delivery Microsystems
Embedded Systems

Lab-on-Chip
MEMS
Microfluidics
Heterogeneous Systems
Implantable Devices

Submissions

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Prospective authors are invited to submit papers on the topics of interest. Submissions should be via the workshop web-site and consist of either an extendedsummary of at least 750 words or a full paper. The accepted papers will be published in an IEEE Computer Society Proceedings available on the IEEE digital library (EXPLORE). Selected papers from the workshop will be invited for submission to a special issue of Journal of Electronic Testing (JETTA).

Key Dates

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Submission deadline: February 21, 2011
Notification of acceptance: March 21, 2011
Final copy deadline: April 21, 2011

Additional Information

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General Information
K.-T. Tim Cheng
ECE Department
University of California
Santa Barbara, CA 93106, USA
Tel.: 1-805-893-7294
E-mail: timcheng@ece.ucsb.edu

Program Information
Haralampos-G. Stratigopoulos
TIMA Laboratory/CNRS
46 Avenue Félix Viallet
38000 Grenoble, France
Tel.: +33 6 83 19 33 88
E-mail: stratigo@imag.fr

Committees

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General Chair
K.-T. Cheng, UCSB, USA

General Co-Chairs
J.-L. Huang, National Taiwan U., Taiwan
B. Kaminska, SFU, Canada

Program Committee Chair
H. Stratigopoulos, TIMA, France

Program Co-Chairs
Signals & Systems:
D. Keezer, Georgia Tech, USA

Sensors:
S. Bhunia, Case Western Res. U.,USA

Panel hair
K. Chakrabarty, Duke U., USA

New Initiatives Chair
B. Courtois, CMP, France

Special Session Chair
I. McWalter, CMC Microsystems, Canada

Publicity Chair
S. Mir, TIMA, France

Publications Chair
M. Comte, U. Montpellier/LIRMM, France

TTTC Liaison
A. Ivanov, UBC, Canada

Local rrangements Chair
H.-M. Chang, UCSB, USA

strong>Program Committee

S. Abdennadher, Intel, USA
J. Abraham, University of Texas, USA
F. Azais, LIRMM, France
K. Arabi, Qualcomm, USA
I. Bell, University of Hull, UK
A. Bermak, HK U. Sc.&Tech., HK
S. Bernard, LIRMM, France
S. Biswas, nVIDIA, USA
A. Chatterjee, Georgia Tech., USA
E. Cretu, U. of British Columbia, Canada
J. Dabrowski, Linkoping U., Sweden
W. Eisenstadt, University of Florida, USA
A. Ghosh, IBM, USA
D. Hong, Broadcom, USA
H.-C. Hong, Natl. ChiaoTung U., Taiwan
H. Kerkhoff, U. of Twente, Netherlands
H. Kobayashi, Gunma University, Japan
J. Machado da Silva, U. of Porto, Portugal
Y. Makris, Yale University, USA
F. Muradali, National Semi., USA
A. Osseiran, Edith Cowan U., Australia
S. Ozev, Arizona State University, USA
M. Renovell, LIRMM, France
A. Richardson, Lancaster University, UK
A. Rueda, University of Sevilla, Spain
S. Sattler, Erlangen University, Germany
M. Sawan, Ecole Polytechnique, Canada
M. Slamani, IBM, USA
G. Srinivasan, Texas Instruments, USA
P.-Y. Wang, MediaTek, Taiwan
Y. Xing, NXP, Netherlands
T. Yamaguchi, Advantest, Japan

Steering Committee

B. Kaminska (Chair)
J. Abraham
A. Chatterjee
B. Courtois
J. Huertas-Diaz
H. Kerkhoff

A. Ivanov
A. Osseiran
M. Renovell
A. Richardson
M. Soma

For more information, visit us on the web at: http://cadlab.ece.ucsb.edu/IMS3TW2011/

The International Mixed-Signals, Sensors, nd Systems Test Workshop (IMS3TW'11) is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) Computer Society's Test Technology Technical Council (TTTC).